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Expression of Interest for Empanelment of System Integrator/ Service Provider for AI enabled High Performance Computing Infrastructure

Educational Consultants India Limited

NOIDA | Gautam Buddha Nagar, Uttar Pradesh

Amount: Refer DocsCloses: 27 Aug 20265 Aug 20263d left

Timeline

Published16 Jul 2026
Pre-Bid Meeting27 Jul 2026
Closes27 Aug 20265 Aug 2026
Bid Opening27 Aug 20266 Aug 2026

Corrigenda

Corrigendum

4 updatesLatest on 19 Aug 20265 Aug 202627 Aug 2026

Updated dates

Bid Submission End27 Aug 20265 Aug 2026Bid Opening27 Aug 20266 Aug 2026Download Ends27 Aug 20265 Aug 2026Clarification Ends24 Jul 2026

Tender Value

Refer Docs

EMD Value

₹5 L

Closing Date

27 Aug 2026, 12:30 pm3d left

Tender Inviting Organisation

Name

CGM (DES)

Address

EdCIL India Limited EdCIL House,18 A, Sector-16 A, Noida, U.P. 201301

Work Description

Expression of Interest for Empanelment of System Integrator/ Service Provider for AI enabled High Performance Computing Infrastructure

Tender Information

Tender ID

2026_EDCIL_845138_1

Reference Number

EdCIL/DES/EOI/AI/2026/01

Tender Type

Open Tender

Product Category

Miscellaneous Works

Form of Contract

Empanelment

Period of Work

365 days

Location

NOIDA

Source Website

Subscribe to view

Eligibility / Pre-Qualification

Please refer Tender documents.

Documents Required

2 documents required · 2 mandatory

Fee/PreQual/Technical/Finance

RequiredTechnical Bid (.pdf)

RequiredBOQ (.xls)

Fee & Financial Details

Tender Fee Amount

₹0

EMD Fee Amount

₹5 L

EMD Fee Exemption Allowed

Yes

Pre-Bid Meeting

Meeting Place

NOIDA

Important Dates

Last Activity

27 Aug 2026

Published

16 Jul 2026

Bid Opening

27 Aug 2026

Download Starts

16 Jul 2026

Download Ends

27 Aug 2026

Submission Starts

16 Jul 2026

Clarification Period

16 Jul 2026 - 24 Jul 2026

Pre-Bid Meeting

27 Jul 2026

Documents

Tap a document below to read it instantly. You can also download everything as a ZIP if you prefer.

Tender Page Snapshot

details.html

html • 0.03 MB

NIT Documents

Tendernotice_1.pdf

PDF • 0.92 MB

Work Item Documents

Empanelment of AI HPC 15.07.2026.pdf

Tender Documents • 0.92 MB

Corrigendum Documents

Corrigendum3.pdf

PDF • 0.08 MB

Corrigendum2.pdf

PDF • 0.03 MB

Corrigendum.pdf

PDF • 0.02 MB

Prebid Meeting Link.pdf

PDF • 0.02 MB

Ready to Participate?

Download all tender documents and submit your bid

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