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THIN FILM WIRE BONDABLE CHIP RESISTORS

Indian Space Research Organisation

U R Rao Satellite Centre, Bangalore | Bengaluru Urban, Karnataka

Amount: ₹2.8 CrCloses: 19 Feb 2026Closed

Tender Value

₹2.8 Cr

Closing Date

19 Feb 2026, 2:30 pmClosed

Tender Inviting Organisation

Name

R Rakesh Kumar

Address

PURCHASE DIVISION, URSC

Work Description

THIN FILM WIRE BONDABLE CHIP RESISTORS

Tender Information

Tender ID

2026_ISRO_827683_1

Reference Number

URSC/PR/IIA/2025000313

Tender Type

Global Tenders

Product Category

Electronics Equipment

Period of Work

210 days

Location

U R Rao Satellite Centre, Bangalore

Source Website

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Eligibility / Pre-Qualification

Please refer Tender documents.

Documents Required

2 documents required · 2 mandatory

Fee/PreQual/Technical

RequiredTHIN FILM WIRE BONDABLE CHIP RESISTORS (.pdf)

Finance

RequiredTHIN FILM WIRE BONDABLE CHIP RESISTORS (.xls)

Fee & Financial Details

Tender Fee Amount

₹0

EMD Fee Amount

Exempted

Important Dates

Last Activity

31 Jan 2026

Published

31 Jan 2026

Bid Opening

19 Feb 2026

Download Starts

31 Jan 2026

Download Ends

19 Feb 2026

Submission Starts

31 Jan 2026

Clarification Period

31 Jan 2026 - 10 Feb 2026

Documents

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Tender Page Snapshot

details.html

html • 0.03 MB

NIT Documents

Tendernotice_1.pdf

PDF • 0.26 MB

Work Item Documents

313 CPP.pdf

Tender Documents • 0.26 MB

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Download all tender documents and submit your bid

THIN FILM WIRE BONDABLE CHIP RESISTORS

Market Intelligence

Tender Inviting Organisation

Work Description

Tender Information

Eligibility / Pre-Qualification

Documents Required

Fee & Financial Details

Important Dates

Documents

Tender Page Snapshot

NIT Documents

Work Item Documents

Ready to Participate?