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Eligibility, documents, scope and key termsEligibility, required documents, scope of work and key terms of this tender, in one click.
| # | Company | Offered Item | Amount | Rank | Status |
|---|---|---|---|---|---|
| 1 | L1₹9.9 LQualified Make: OEM
Model: MUSTER INTERNATIONAL
Title: Development of Laser Firing PCB for TO Package Laser Diode | Make: OEM
Model: MUSTER INTERNATIONAL
Title: Development of Laser Firing PCB for TO Package Laser Diode | L1 | Qualified MSE, MII, Category: General | |
| 2 | L2₹10.0 L+₹5,900 (0.60%)Qualified Make: OEM
Model: MAFFICK/2024/TBRL/0066
Title: Development of Laser Firing PCB for TO Package Laser Diode | Make: OEM
Model: MAFFICK/2024/TBRL/0066
Title: Development of Laser Firing PCB for TO Package Laser Diode | L2 | Qualified MSE, MII, Category: General | |
| 3 | L3₹10.2 L+₹27,140 (2.74%)Qualified Make: AUJUS TECHNOLOGY
Model: AUJ-LFPCB-2024
Title: Development of Laser Firing PCB for TO Package Laser Diode A1 269 GF BEETWEEN A1 TO 264 TO A 1 279 BLOCK OPP PARK SAFDAR JUNG ENCLAVE SOUTH WEST DELHI DELHI 110029 | SOUTH DELHI | DELHI | 110029 | Make: AUJUS TECHNOLOGY
Model: AUJ-LFPCB-2024
Title: Development of Laser Firing PCB for TO Package Laser Diode | L3 | Qualified MSE, MII, Category: General | |
| 4 | L4₹10.2 L+₹29,500 (2.98%)Qualified Make: RAI
Model: 55X-PCB
Title: Development of Laser Firing PCB for TO Package Laser Diode 439 NA SHIV PURI AMBALA HARYANA 133001 | AMBALA | HARYANA | 133001 | Make: RAI
Model: 55X-PCB
Title: Development of Laser Firing PCB for TO Package Laser Diode | L4 | Qualified MSE, MII, Category: General | |
| 5 | L5₹13.2 L+₹3.3 L (33.3%)Qualified Make: JPL
Model: JPL/Laser Firing PCB
Title: Development of Laser Firing PCB for TO Package Laser Diode 28 OLYMPIA TEKSNOS PARK SIDCO INDUSTRIAL ESTATE GUINDY CHENNAI TAMIL NADU 600032 | CHENNAI | TAMIL NADU | 600032 | Make: JPL
Model: JPL/Laser Firing PCB
Title: Development of Laser Firing PCB for TO Package Laser Diode | L5 | Qualified MSE, MII, Category: General |
Tender Value
Refer Docs
EMD Value
₹27,616
Closing Date
28 Nov 2024, 10:00 amClosed
Eligibility, documents, scope and key termsEligibility, required documents, scope of work and key terms of this tender, in one click.
Development of Laser Firing PCB for TO Package Laser Diode
7054760
GEM/2024/B/5533528
Two Packet Bid
Development of Laser Firing PCB for TO Package Laser Diode
180 days
Haryana; Panchkula
Total value wise evaluation
PRODUCT_CUSTOM
1 document required · 1 mandatory
| Item | Delivery Location | Qty | Delivery |
|---|---|---|---|
| Development of Laser Firing PCB for TO Package Laser Diode | PANCHKULA | 20 | 180 days |
₹27,616
8 Feb 2025
6 Nov 2024
28 Nov 2024
Tap a document below to read it instantly. You can also download everything as a ZIP if you prefer.
bid_7054760.pdf
GEM_BID
p-tb33-92_scope_2024-10-22-15-30-23_23007dcdf854482769a684686737e54b.pdf
SPECIFICATION
list-of-categories-where-trials-are-allowed_1712126171.pdf
OTHER
gtc.pdf
OTHER
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