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Tender ID
Eligibility, documents, scope and key termsEligibility, required documents, scope of work and key terms of this tender, in one click.
| # | Company | Amount | Rank | Status |
|---|---|---|---|---|
| 1 | L1₹1.4 CrAccepted-AOC NO 99 2 4TH MAIN 7TH CROSS CHAMRAJPET BANGALORE 560018 | BENGALURU URBAN | KARNATAKA | 560018 | L1 | Accepted-AOC BEING L1 |
| Sl No | Description | Qty | Unit | SOCIETY FOR INTEGRATED CIRCUIT TECHNOLOGY AND APPLIED RESEARCH L1 |
|---|---|---|---|---|
| 1.00Photolithography, Indium Deposition and optimization of Flip Chip Bonding | ||||
| 1.01 | Photolithography, Indium Deposition and optimization of Flip Chip Bonding as per specification details attached at annexure 'V' | 80 | Nos. | 1,18,00,000 ₹1,39,24,000 Lowest |
Tender Value
Refer Docs
EMD Value
₹7.0 L
Closing Date
23 Apr 2026, 2:00 pmClosed
Eligibility, documents, scope and key termsEligibility, required documents, scope of work and key terms of this tender, in one click.
KUNAL BHUSHAN, SR. STORES OFFICER-II
DRDO, SSPL, LUCKNOW ROAD, TIMARPUR, DELHI,INDIA
Photolithography, Indium Deposition and optimization of Flip Chip Bonding
2026_DRDO_759906_1
SSPL/MMG/DPP/SBM/B/R/25-26/229
Single
Miscellaneous Goods
Supply
360 days
SSPL
Please refer Tender documents.
2 documents required · 2 mandatory
₹0
₹7.0 L
Yes
9 Nov 2026
10 Apr 2026
24 Apr 2026
10 Apr 2026
23 Apr 2026
10 Apr 2026
| Sl No | Description | Qty | Unit | Est. Rate | Est. Amount |
|---|---|---|---|---|---|
| 1Photolithography, Indium Deposition and optimization of Flip Chip Bonding | |||||
| 1.01 | Photolithography, Indium Deposition and optimization of Flip Chip Bonding as per specification details attached at annexure 'V' | - | Nos. | - | - |
stage.html
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tech_bid_open.pdf
tech_eval.pdf
fin_bid_open.pdf
boq_comp_chart.xlsx
xlsx
fin_eval.pdf
aoc.pdf
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details.html
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Tendernotice_1.pdf
PDF • 1.89 MB
RFP2526229.pdf
Tender Documents • 3.12 MB
BOQ_851172.xls
BOQ • 0.31 MB
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