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Advertisement Tender Enquiry for Chip Sealing device

Department Of Health Research

ICMR-NIV MUMBAI UNIT | Mumbai, Maharashtra

Amount: ₹2 LCloses: 11 Jul 2026Due today

Tender Value

₹2 L

Closing Date

11 Jul 2026, 3:00 pmDue today

Tender Inviting Organisation

Name

THE OFFICER-IN-CHARGE

Address

HAFFKINE INSTITUTE COMPOUND, ACHARYA DONDHE MARG, PAREL-MUMBAI - 400012

Work Description

Chip Sealing / Device Bonder

Tender Information

Tender ID

2026_DoHR_843552_1

Reference Number

Pur/PP 1611/e-file 282963/2026-27

Tender Type

Open Tender

Product Category

Consumables (Hospital / Lab)

Period of Work

21 days

Location

ICMR-NIV MUMBAI UNIT

Source Website

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Eligibility / Pre-Qualification

Please refer Tender documents.

Documents Required

1 document required · 1 mandatory

Fee/PreQual/Technical/Finance

RequiredSealed Quotation invited for purchase of Chip sealing device/Device border, Qty-1No (.xls)

Fee & Financial Details

Tender Fee Amount

₹0

EMD Fee Amount

Exempted

Important Dates

Last Activity

2 Jul 2026

Published

2 Jul 2026

Bid Opening

13 Jul 2026

Download Starts

2 Jul 2026

Download Ends

11 Jul 2026

Submission Starts

2 Jul 2026

Documents

Tap a document below to read it instantly. You can also download everything as a ZIP if you prefer.

Tender Page Snapshot

details.html

html • 0.03 MB

NIT Documents

Tendernotice_1.pdf

PDF • 0.82 MB

Work Item Documents

ATE 1611.pdf

Tender Documents • 0.82 MB

Ready to Participate?

Download all tender documents and submit your bid