CPPP

Active

Low Competition

Goods

Electronic Components And Devices

Supply of Ceramic IC Package PGA 228

Semi-Conductor Laboratory (SCL)

Semi Conductor Laboratory | S.A.S Nagar, Punjab

Amount: Refer DocsCloses: 23 Dec 20251 Dec 2025

Corrigendum

Closed

Corrigenda

Corrigendum

3 updatesLatest on 1 Dec 20251 Dec 202523 Dec 2025

Updated dates

Bid Submission End23 Dec 20251 Dec 2025

Bid Opening24 Dec 20252 Dec 2025

Download Ends23 Dec 20251 Dec 2025

Clarification Ends21 Nov 2025

Tender Value

Refer Docs

Closing Date

23 Dec 2025, 2:00 pmClosed

Tender Inviting Organisation

Name

Naresh Singh PSO

Address

Semi Conductor Laboratory

Work Description

Supply of Ceramic IC Package PGA 228

Tender Information

Tender ID

2025_SCL_886086_1

Reference Number

SCL/PS/45158/VAHD/2025

Tender Type

Single

Product Category

Electronic Components And Devices

Period of Work

270 days

Location

Semi Conductor Laboratory

Source Website

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Eligibility / Pre-Qualification

Please refer Tender documents.

Documents Required

6 documents required · 6 mandatory

Fee/PreQual/Technical/Finance

RequiredCompliance to Commercial Terms and Conditions (.pdf)

RequiredTender Acceptance Letter (.pdf)

RequiredComplinace to Specifications (.pdf)

RequiredOther Document, if any (.pdf)

RequiredBOQ (.xls)

RequiredBOQ duly signed stamped and scanned copy to be uploaded (.pdf)

Fee & Financial Details

Tender Fee Amount

₹0

EMD Fee Amount

Exempted

Important Dates

Last Activity

18 Nov 2025

Published

18 Nov 2025

Bid Opening

24 Dec 2025

Download Starts

18 Nov 2025

Download Ends

23 Dec 2025

Submission Starts

18 Nov 2025

Clarification Period

18 Nov 2025 - 21 Nov 2025

BOQ Preview

•

Ceramic IC Package-PGA 228 for Imager-4 (Development, fabrication and supply) as per specifications in Annexure-I and II

•

One Time NRE charges

Documents

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Tender Page Snapshot

details.html

html • 0.03 MB

NIT Documents

Tendernotice_1.pdf

PDF • 1.20 MB

Work Item Documents

BOQ_931373.xls

BOQ • 0.22 MB

Ready to Participate?

Download all tender documents and submit your bid

Supply of Ceramic IC Package PGA 228

Corrigenda

Market Intelligence

Tender Inviting Organisation

Work Description

Tender Information

Eligibility / Pre-Qualification

Documents Required

Fee & Financial Details

Important Dates

BOQ Preview

Documents

Tender Page Snapshot

NIT Documents

Work Item Documents

Ready to Participate?