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| # | Company | Offered Item | Amount | Rank | Status |
|---|---|---|---|---|---|
| 1 | L1₹46.8 LQualified Make: MPP
Model: iBond5000-Dual
Title: Wire Bonder System | Make: MPP
Model: iBond5000-Dual
Title: Wire Bonder System | ₹46.8 L | L1 | Qualified MII |
| 2 | L2₹66.4 LQualified Make: NA
Model: HB16 Semiautomatic Wire Bonder
Title: Wire Bonder System | Make: NA
Model: HB16 Semiautomatic Wire Bonder
Title: Wire Bonder System | ₹66.4 L | L2 | Qualified MII |
| 3 | L3₹79 LQualified Make: Unbrand
Model: WB-300-U
Title: Wire Bonder System | Make: Unbrand
Model: WB-300-U
Title: Wire Bonder System | ₹79 L | L3 | Qualified MII |
| 4 | Disqualified Make: Unbrand
Model: JFP Microtechnic WB-100 e
Title: Wire Bonder System | Make: Unbrand
Model: JFP Microtechnic WB-100 e
Title: Wire Bonder System | - | - | Disqualified |
Tender Value
Refer Docs
EMD Value
Exempted
Closing Date
27 Mar 2026, 12:00 pmClosed
Wire Bonder System
9052306
GEM/2026/B/7297424
Two Packet Bid
Wire Bonder System
North Delhi, Delhi
Total value wise evaluation
PRODUCT_CUSTOM
| Item | Delivery Location | Qty | Delivery |
|---|---|---|---|
| Wire Bonder System | - | 1 | - |
Director, Solid State Physics Laboratory, Delhi, Department of Defence Research & Development, Office of DG ( MED &, COS), Ministry of Defence, (Director Sspl), UIN Number NCTGC2415P, 2/7
Exempted
Yes
1 Jul 2026
9 Mar 2026
27 Mar 2026
Tap a document below to read it instantly. You can also download everything as a ZIP if you prefer.
bid_9052306.pdf
GEM_BID
specification_wire_bonder_system_2026-02-24-15-17-58_eb016ca158af083ce74e236f647d3843.pdf
SPECIFICATION
list-of-categories-where-trials-are-allowed_1712126171.pdf
OTHER
gtc.pdf
OTHER
specification_wire_bonder_system_2026-02-24-15-17-58_eb016ca158af083ce74e236f647d3843.pdf
GEM_SPEC • 0.59 MB
list-of-categories-where-trials-are-allowed_1712126171.pdf
GEM_OTHER • 0.52 MB
gtc.pdf
GEM_OTHER • 0.70 MB
Download all tender documents and submit your bid