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| # | Company | Status |
|---|---|---|
| 1 | Accepted-Technical | Accepted-Technical Technically acceptable |
| 2 | Accepted-Technical | Accepted-Technical Technically acceptable |
| 3 | Accepted-Technical | Accepted-Technical Technically acceptable |
Tender Value
Refer Docs
EMD Value
₹15 L
Closing Date
18 Jun 2026, 2:00 pmClosed
Naresh Singh, PSO
Semi Conductor Laboratory
One Year Rate Contract for Pkgs and Lids
2026_SCL_908011_1
45183
Global Tenders
Electronic Components And Devices
Supply
120 days
Semi Conductor Laboratory
Please refer Tender documents.
9 documents required · 9 mandatory
₹0
₹15 L
Yes
14 Aug 2026
8 May 2026
19 Jun 2026
8 May 2026
18 Jun 2026
8 May 2026
8 May 2026 - 15 May 2026
| Sl No | Description | Qty | Unit | Est. Rate | Est. Amount |
|---|---|---|---|---|---|
| 1Spares for Dicing Saw (Disco, DAD 3660) | |||||
| 1.01 | Ceramic IC Package - 8 pin CSOP (die cavity 3.3mm x 3.3mm) | - | Nos | - | - |
| 1.02 | Ceramic IC Package - 14 pin CSOP (die cavity 3.81mm x 3.81mm) | - | Nos | - | - |
| 1.03 | Sealing Lid With Perform; Drawn OD 250mils x 250mils ID 210mils x 210mils | - | Nos | - | - |
| 1.04 | Ceramic IC Package -14pin CSOP (die cavity 6.47mm x 3.96mm) | - | No | - | - |
| 1.05 | Sealing Lid With Perform; Drawn OD 380 mils x 245mils, ID 0340mils x 215mils | - | Nos | - | - |
| 1.06 | Ceramic IC Package - 16pin CSOP (die cavity 4.19mm x 3.81mm) | - | Nos | - | - |
| 1.07 | Sealing Lid With Preform: Drawn OD300 mils x 250mils ID 250mils x 205mils | - | Nos | - | - |
| 1.08 | Ceramic IC Package 22 Pin CDIP, Die cavity: 7.11mm x 6.6mm | - | Nos | - | - |
| 1.09 | Sealing Lid with Preform (LWP) - OD407 x 370 ID 410 x 345 | - | Nos | - | - |
stage.html
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tech_bid_open.pdf
tech_eval.pdf
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details.html
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Tendernotice_1.pdf
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Tendernotice_2.pdf
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Tendernotice_3.pdf
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BOQ_954361.xls
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CCU.rar
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