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Tender Value
Refer Docs
EMD Value
₹15 L
Closing Date
8 Jun 2026, 2:00 pmDue tomorrow
Naresh Singh, PSO
Semi Conductor Laboratory
One Year Rate Contract for Pkgs and Lids
2026_SCL_908011_1
45183
Global Tenders
Electronic Components And Devices
120 days
Semi Conductor Laboratory
Please refer Tender documents.
9 documents required · 9 mandatory
₹0
₹15 L
Yes
8 May 2026
8 May 2026
9 Jun 2026
8 May 2026
8 Jun 2026
8 May 2026
8 May 2026 - 15 May 2026
| Sl No | Description | Qty | Unit | Est. Rate | Est. Amount | Item Code |
|---|---|---|---|---|---|---|
| 1Spares for Dicing Saw (Disco, DAD 3660) | ||||||
| 1.01 | Ceramic IC Package - 8 pin CSOP (die cavity 3.3mm x 3.3mm) | - | Nos | - | - | 230216171 |
| 1.02 | Ceramic IC Package - 14 pin CSOP (die cavity 3.81mm x 3.81mm) | - | Nos | - | - | 230216110 |
| 1.03 | Sealing Lid With Perform; Drawn OD 250mils x 250mils ID 210mils x 210mils | - | Nos | - | - | 230216124 |
| 1.04 | Ceramic IC Package -14pin CSOP (die cavity 6.47mm x 3.96mm) | - | No | - | - | 230216109 |
| 1.05 | Sealing Lid With Perform; Drawn OD 380 mils x 245mils, ID 0340mils x 215mils | - | Nos | - | - | 230216123 |
| 1.06 | Ceramic IC Package - 16pin CSOP (die cavity 4.19mm x 3.81mm) | - | Nos | - | - | 230216088 |
| 1.07 | Sealing Lid With Preform: Drawn OD300 mils x 250mils ID 250mils x 205mils | - | Nos | - | - | 230216090 |
| 1.08 | Ceramic IC Package 22 Pin CDIP, Die cavity: 7.11mm x 6.6mm | - | Nos | - | - | 230216200 |
| 1.09 | Sealing Lid with Preform (LWP) - OD407 x 370 ID 410 x 345 | - | Nos | - | - | 230216202 |
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