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Tender Value
₹9.9 L
EMD Value
₹9,853
Closing Date
19 Jun 2026, 3:00 pm2d left
Superintending Engineer
Superintending Engineer, Generation Circle, HPSEBL, Palampur
Tender for providing and fixing of new microprocessor based electronic governor card for Heinzmanns Make Governor of Unit No I including testing and installation of programming in HMI screen at Gaj Power House under Khauli Power House Division
2026_HPSEB_136459_1
HPSEBL/SE/GCP-03/2026-27
Open Tender
Electrical Works
Gaj HEP under Khauli Division
Please refer Tender documents.
5 documents required · 5 mandatory
₹590
₹9,853
12 Jun 2026
12 Jun 2026
20 Jun 2026
12 Jun 2026
19 Jun 2026
12 Jun 2026
12 Jun 2026 - 19 Jun 2026
This is a percentage-rate BOQ. The schedule below shows estimated quantities and rates. Bidders quote a single percentage above or below the total estimated cost.
| Sl No | Description | Qty | Unit | Est. Rate | Est. Amount | Item Code |
|---|---|---|---|---|---|---|
| 1 | Tender for providing & fixing of new microprocessor based electronic governor card for Heinzmann’s Make Governor of Unit No. I including testing and installation of programming in HMI screen at Gaj Power House under Khauli Power House Division, HPSEBL Darini. | 1 | Job | 9,85,300 | ₹9,85,300 | 1111 |
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details.html
html • 0.03 MB
Tendernotice_1.pdf
PDF • 0.38 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_0.Cover Page Volume-I.doc
Tender Documents • 0.03 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_1. Vol-I_Section-I_IFB.docx
Tender Documents • 0.03 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_2.Vol-I_Section-II_ITB.docx
Tender Documents • 0.08 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_3. Vol-I_Section-III_BDS.docx
Tender Documents • 0.03 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_3a Vol-I, Section-III PQR.docx
Tender Documents • 0.02 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_4. Vol-I_Section-IV_GCC.docx
Tender Documents • 0.14 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_5. Vol-I_Section-V_SCC.docx
Tender Documents • 0.02 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_5a. Annex I to SCC (Vol-I, Section-V).docx
Tender Documents • 0.01 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_6. Vol-I_Section VI_Forms.docx
Tender Documents • 0.19 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-I_6a. Annex-A to Appendix-4_Vol-I_Section VI.xlsx
Tender Documents • 0.01 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-II_0. Cover Page Volume-II.doc
Tender Documents • 0.03 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-II_1. Vol-II_Section-I_PMS, QAM & PMA.docx
Tender Documents • 0.04 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-II_2. Vol-II_Sec-II_Bid form.docx
Tender Documents • 0.09 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-III_0.CoverPageVolume-III.doc
Tender Documents • 0.03 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-III_GCP3Technicalspecifications.docx
Tender Documents • 0.03 MB
BiddocumentGajmicroprocessorGovernorgcp03_Volume-III_technical specifications.pdf
Tender Documents • 4.29 MB
BOQ_201975.xls
BOQ • 1.20 MB
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