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| # | Company | Offered Item | Amount | Rank | Status |
|---|---|---|---|---|---|
| 1 | L1₹4.5 CrQualified Make: NA
Model: LDS-13B-6L
Title: Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish SUBRAMANYAPURA BENGALURU KARNATAKA SUBRAMANYAPURA BANGALORE KARNATAKA 560061 UDYAM KR 03 0579663 | BENGALURU URBAN | KARNATAKA | 560061 | Make: NA
Model: LDS-13B-6L
Title: Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish | ₹4.5 Cr Quoted ₹5.1 Cr | L1 | Qualified MII |
| 2 | Disqualified Make: INTEGRATED EQUIPMETS
Model: Engis EAG-28DMMNX Semi Auto12"Dual spindle Grinder
Title: Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish 1 7 297 20 DR RANJI BLOCK I FLOOR 125 M G ROAD SECUNDERABAD HYDERABAD TELANGANA 500003 | HYDERABAD | TELANGANA | 500003 | Make: INTEGRATED EQUIPMETS
Model: Engis EAG-28DMMNX Semi Auto12"Dual spindle Grinder
Title: Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish | - | - | Disqualified |
| 3 | Disqualified Make: RAANA SEMICONDUCTORS PRIVATE LIMITED
Model: RSPL/MWS-150
Title: Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish NO L 732 A NEW NO 6 NEW ASTC HUDCO HOSUR TAMIL NADU 635109 | KRISHNAGIRI | TAMIL NADU | 635109 | Make: RAANA SEMICONDUCTORS PRIVATE LIMITED
Model: RSPL/MWS-150
Title: Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish | - | - | Disqualified MSE, Category: General |
Tender Value
₹4.5 Cr
EMD Value
Exempted
Closing Date
10 Jan 2026, 10:00 amClosed
Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish
8714332
GEM/2025/B/7001649
Two Packet Bid
GeM Contract
Medchal Malkajgiri, Telangana
Total value wise evaluation
PRODUCT_CUSTOM
Awarded to PICOTECH SERVICES INDIA PRIVATE LIMITED
₹4.5 Cr
| Product | Brand / Model | HSN | Quantity | Unit Price | Amount |
|---|---|---|---|---|---|
| Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish | NA / LDS-13B-6L | HSN not specified by seller | 1 Lot | 45,100,000 | 45,100,000 |
8 documents required · 8 mandatory
1 yrs
₹1.8 Cr
₹2.5 Cr
50%
| Item | Delivery Location | Qty | Delivery |
|---|---|---|---|
| Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish | - | 1 | - |
Centre Head, Centre for Materials for Electronics Technology (CMET), IDA Phase 3, HCL (PO) Cherlapally Hyderabad 500051, (S Rajesh)
Exempted
21 May 2026
20 Dec 2025
10 Jan 2026
contract_GEMC-511687771768666.pdf
GEM_CONTRACT • 0.10 MB
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bid_8714332.pdf
GEM_BID
svc__technical_specifications_2025-12-15-10-18-53_14ba8655c336c79dc24919cf70075af2.pdf
SPECIFICATION
ATC_ed75492b-ca71-4264-a6801765777021936_akshdeep.sharma@cmet.gov.in.pdf
OTHER
list-of-categories-where-trials-are-allowed_1712126171.pdf
OTHER
gtc.pdf
OTHER
svc__technical_specifications_2025-12-15-10-18-53_14ba8655c336c79dc24919cf70075af2.pdf
GEM_SPEC • 0.98 MB
ATC_ed75492b-ca71-4264-a6801765777021936_akshdeep.sharma@cmet.gov.in.pdf
GEM_OTHER • 0.10 MB
list-of-categories-where-trials-are-allowed_1712126171.pdf
GEM_OTHER • 0.52 MB
gtc.pdf
GEM_OTHER • 0.70 MB
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