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| # | Company | Status |
|---|---|---|
| 1 | Admitted-Fee/PreQual/Technical | Admitted-Fee/PreQual/Technical |
| 2 | Admitted-Fee/PreQual/Technical | Admitted-Fee/PreQual/Technical |
| 3 | TESSCORN SYSTEMS INDIA PRIVATE LIMITED Admitted-Fee/PreQual/Technical | Admitted-Fee/PreQual/Technical |
Tender Value
Refer Docs
EMD Value
₹9 L
Closing Date
21 Jan 2026, 2:00 pmClosed
SR. STORES OFFICER-II
DRDO, SSPL, LUCKNOW ROAD, TIMARPUR, DELHI, INIDA
Automatic Wafer Dicing Machine
2025_DRDO_742704_1
SPL/GEM/BU/C/24-25/277
Global Tenders
Miscellaneous Goods
Supply
120 days
SSPL
Please refer Tender documents.
2 documents required · 2 mandatory
₹0
₹9 L
Yes
6 Jan 2026
4 Dec 2025
22 Jan 2026
4 Dec 2025
21 Jan 2026
5 Dec 2025
Automatic Wafer Dicing Machine
Automatic Wafer Dicing Machine as per specification details attached at annexure 'V' (Including 36 Months Warranty)
CAMC : 03 Years
tech_bid_open.pdf
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details.html
html • 0.03 MB
Tendernotice_1.pdf
PDF • 2.91 MB
RFP2425277.pdf
Tender Documents • 3.19 MB
BOQ_831682.xls
BOQ • 0.31 MB
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