DEFPROC

Financial BO

Goods

Miscellaneous Goods

Flip Chip Bonder

Department of Defence Research and Development

DIRECTOR, SSPL | Central, Delhi

Amount: Refer DocsCloses: 8 Jun 2020Closed

Bids

1 Bid8 Mar 2021

#	Company	Status
1	Admitted-Finance	Admitted-Finance

Tender Value

Refer Docs

EMD Value

₹20.9 L

Closing Date

8 Jun 2020, 2:00 pmClosed

Tender Inviting Organisation

Name

HITESH KUMAR, SSO-I

Address

DIRECTOR, SSPL, DELHI

Work Description

Flip Chip Bonder

Tender Information

Tender ID

2020_DRDO_339935_1

Reference Number

SPL/MMG/OBM/SPL155/C/19-20/112

Tender Type

Open Tender

Product Category

Miscellaneous Goods

Period of Work

300 days

Location

DIRECTOR, SSPL

Source Website

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Eligibility / Pre-Qualification

Please refer Tender documents.

Documents Required

8 documents required · 8 mandatory

Fee/PreQual/Technical

Requiredi) Tender Acceptance Letter (Annexure-I). (.pdf)

Requiredii) Mandatory Techno-Commercial Terms (Annexure-II). (.pdf)

Requirediii) End User Certificate (Annexure-III), if applicable (.pdf)

Requirediv) Specification compliance (Annexure-IV) (.pdf)

Requiredv) Signed and Scanned copy of appropriate valid company registration certificate or partnership deed (.pdf)

Requiredvi) Scanned copy of instruments used to provide Earnest Money Deposit or Proof of Registration (.pdf)

Requiredvii) Signed and Scanned Copy of Techno Commercial Terms Conditions (.pdf)

Finance

Required(a) Schedule of Price bid in Excel format (XXXX. xls.) (.xls)

Fee & Financial Details

Tender Fee Amount

₹1

Tender Fee Exemption Allowed

Yes

Tender Fee Payable To

SUBMIT ANY DD NUMBER FOR IGNORING TENDER FEE

EMD Fee Amount

₹20.9 L

EMD Fee Exemption Allowed

Yes

Important Dates

Last Activity

8 Mar 2021

Published

21 Apr 2020

Bid Opening

9 Jun 2020

Download Starts

21 Apr 2020

Download Ends

8 Jun 2020

Submission Starts

21 Apr 2020

BOQ Preview

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FLIP CHIP BONDER

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FLIP CHIP BONDER as per attached specificiation at Annexure IV with standerd warranty of 03 years

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US Dollar

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European Euro

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British Pound

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Japanese yen

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US Dollar

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European Euro

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British Pound

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Japanese yen

Stage Documents

Stage Summary Snapshot

stage.html

html • 0.03 MB

Technical Bid Opening

tech_bid_open.pdf

PDF

Technical Evaluation

tech_eval.pdf

PDF

Financial Bid Opening

fin_bid_open.pdf

PDF

boq_comp_chart.xlsx

xlsx

Documents

Tap a document below to read it instantly. You can also download everything as a ZIP if you prefer.

Tender Page Snapshot

details.html

html • 0.03 MB

Ready to Participate?

Download all tender documents and submit your bid