Loading
Loading…
Loading…
| # | Company | Status |
|---|---|---|
| 1 | Admitted-Finance | Admitted-Finance |
| 2 | Admitted-Finance NO 50 NTI LAYOUT BHOOPSANDRA MAIN ROAD RMV 2ND STAGE BHOOPASANDRA BANGALORE KARNATAKA 560094 | BENGALURU URBAN | KARNATAKA | 560094 | Admitted-Finance |
| 3 | Admitted-Finance | Admitted-Finance |
| 4 | Admitted-Finance PLOT NO 31 P2 SEMICON PARK ELECTRONIC CITY ELECTRONIC CITY PHASE II BENGALURU BANGALORE KARNATAKA 560100 | BENGALURU URBAN | KARNATAKA | 560100 | Admitted-Finance |
| 5 | Admitted-Finance | Admitted-Finance |
Tender Value
Refer Docs
Closing Date
30 Mar 2021, 1:30 pmClosed
Director CAIR
C V Raman Nagar Bangalore 560093
Engineering and Fabrication of Wireless Link Communication Platform
2021_DRDO_421652_1
CAIR/21ISR134/21ATT075/LP
Open Tender
Miscellaneous Services
Supply
270 days
CAIR Bangalore
Please refer Tender documents.
2 documents required · 2 mandatory
₹0
Exempted
CAIR Banaglore
21 May 2021
16 Feb 2021
31 Mar 2021
17 Feb 2021
30 Mar 2021
10 Mar 2021
17 Feb 2021 - 24 Mar 2021
3 Mar 2021
Engineering and Fabrication of Wireless Link Communication Platform
Engineering and Fabrication of Wireless Link Communication Platform
NRE Charges
Dexcel Electronics Designs Private Limited
Innovation Communications Systems Ltd
Electrowing technologies private limited
Tessolve Semiconductor Pvt. Ltd.
stage.html
html • 0.04 MB
tech_bid_open.pdf
tech_eval.pdf
fin_bid_open.pdf
boq_comp_chart.xlsx
xlsx
Tap a document below to read it instantly. You can also download everything as a ZIP if you prefer.
details.html
html • 0.03 MB
Download all tender documents and submit your bid
Disclaimer: TenderKart has made every reasonable effort to ensure that the information on this page is accurate and authentic, however it cannot be held liable for any third-party claims or losses or any damages. TenderKart makes no warranty, expressed or implied, as to the results obtained from the use of this information. If you notice any error or omission, please let us know at .