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Tender Value
Refer Docs
Closing Date
9 Oct 2026, 2:00 pm
Space Applications Centre, Ahmedabad
Space Applications Centre, Ahmedabad, Gujarat
Backend design, Fabrication, Testing and delivery of Multi-core Digital Processing and Control RH ASICs (MDPC) using 65nm/55nm node using RHBD/RHBP CMOS Process
SA202600151901
SAC/HPUR/SA202600151901
Goods
Space Applications Centre, Ahmedabad
9 Oct 2026
24 Sept 2026
9 Oct 2026
9 Sept 2026
1 Oct 2026
| Sl No | Description | Qty | Unit | Est. Rate | Est. Amount |
|---|---|---|---|---|---|
| 1 | ASIC FABRICATION "MDPC ASIC Physical design" | - | - | - | - |
| 2 | ASIC FABRICATION "Wafer fabrication through latest MPW run (Qty- Minimum 50 bare die) " | - | - | - | - |
| 3 | ASIC FABRICATION "MCM Package development, NanoXplore FPGA Die (NG-MEDIUM NX1H35AS-DIECOM, Qty-15), Package Assembly, testing and delivery of MDPC ASIC (Qty-15) ZIF socket carrier & Dummy packages (Qty-5 each)" | - | - | - | - |
| 4 | ASIC FABRICATION "Radiation Testing of packaged MDPC ASIC" | - | - | - | - |
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Tender_Document_SA202600151901.pdf
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Cost_Breakup_Document_Annexure_3.pdf
pdf • 0.36 MB
Final_MDPC_RH_ASIC_RFP_11082026.pdf
pdf • 3.90 MB
SA202600151901-24-09-2026 15:56.pdf
pdf • 0.05 MB
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