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| # | Company | Amount | Rank | Status |
|---|---|---|---|---|
| 1 | L1₹7.9 LAdmitted-Finance | ₹7.9 L | L1 | Admitted-Finance |
| Sl No | Description | Qty | Unit | SINCERE ELECTROPLATINGS L1 |
|---|---|---|---|---|
| 1.00 | ELECTRO PLATING OF SILVER ON COPPER & CU. ALLOY COMPONENTS OF OLTC AS PER IS:1771-1970
THICKNESS OF SILVER COATING :
5 MICRONS MIN. SILVER PLATING IS REQUIRED AT THE ENTIRE SURFACE OF THE CONTACTS. | 200 | KG | 7,90,000 ₹7.9 L |
Tender Value
Refer Docs
EMD Value
₹5,600
Closing Date
24 Jan 2026, 12:00 pmClosed
SMRSM
TELK, ANGAMALY
SILVER ELECTRO PLATING ON COPPER AND COPPER ALLOY COMPONENTS OF OLTC
2026_TEKL_826208_2
TELK/AMM1/26/95
Open Tender
Miscellaneous Works
TELK, ANGAMALY
Please refer Tender documents
2 documents required · 2 mandatory
₹0
₹5,600
Yes
19 Mar 2026
17 Jan 2026
26 Jan 2026
17 Jan 2026
24 Jan 2026
17 Jan 2026
ELECTRO PLATING OF SILVER ON COPPER & CU. ALLOY COMPONENTS OF OLTC AS PER IS:1771-1970 THICKNESS OF SILVER COATING : 5 MICRONS MIN. SILVER PLATING IS REQUIRED AT THE ENTIRE SURFACE OF THE CONTACTS.
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