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| # | Company | Amount | Rank | Status |
|---|---|---|---|---|
| 1 | L1₹72.2 LAdmitted-Finance | ₹72.2 L | L1 | Admitted-Finance |
| Sl No | Description | Qty | Unit | Imec India Private Limited L1 |
|---|---|---|---|---|
| 1.00Cost: MPW 55 nm ULP eFlash Actual block size after shrink:8mm2 | ||||
| 1.01 | NRE: 565 nm CMOS ULP eFlash | 1 | Set | 44,85,093.86 ₹44,85,093.86 Lowest |
| 1.02 | NRE: IP Merge & LVS | 1 | Set | 6,52,540 ₹6,52,540 Lowest |
| 1.03 | Cost for Die sawing | 100 | Nos | 55,932 ₹55,932 Lowest |
| 2.00Cost: QFN40 (5mmx5mm) Packaging | ||||
| 2.01 | Packaging cost for 100 dies : QFN40 (5mmx5mm) (All inclusive) | 100 | Nos | 5,22,032 ₹5,22,032 Lowest |
| 3.00 | Additinal Fabrication Cost for 100 dies | 1 | Set | 11,47,165.32 ₹11,47,165.32 Lowest |
| 4.00 | Additinal Packaging Cost for 100 dies | 1 | Set | 3,58,897 ₹3,58,897 Lowest |
Tender Value
Refer Docs
Closing Date
16 Mar 2026, 6:00 pmClosed
SECTION HEAD PHS
CDAC,TRIVANDRUM
Fabrication, Packaging and Supply of NAADA 2.0 ASICs
2026_DIT_901369_1
CDAC.PHS.HDG095D.CPPP.25.25-26
Open Tender
Electronic Components And Devices
Supply
320 days
CDAC(T)
Please refer Tender documents.
3 documents required · 3 mandatory
₹0
Exempted
19 Mar 2026
5 Mar 2026
18 Mar 2026
5 Mar 2026
16 Mar 2026
8 Mar 2026
5 Mar 2026 - 6 Mar 2026
Cost: MPW 55 nm ULP eFlash Actual block size after shrink:8mm2
NRE: 565 nm CMOS ULP eFlash
NRE: IP Merge & LVS
Cost for Die sawing
Cost: QFN40 (5mmx5mm) Packaging
Packaging cost for 100 dies : QFN40 (5mmx5mm) (All inclusive)
Additinal Fabrication Cost for 100 dies
Additinal Packaging Cost for 100 dies
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