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Tender Value
Refer Docs
EMD Value
Exempted
Closing Date
1 Sept 2026, 3:00 pm3d left
Wirebond removal for BGA packaged semiconductor chips
9777441
GEM/2026/B/7936231
Two Packet Bid
Wirebond removal for BGA packaged semiconductor chips
Thiruvananthapuram, Kerala
Total value wise evaluation
PRODUCT_CUSTOM
| Item | Delivery Location | Qty | Delivery |
|---|---|---|---|
| Wirebond removal for BGA packaged semiconductor chips | Dhanya S 695033,Purchase Department, Centrefor Developmentof Advanced Computing, Vellayambalam | 1 | 30 days |
Exempted
Yes
19 Aug 2026
19 Aug 2026
1 Sept 2026
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bid_9777441.pdf
GEM_BID • 0.09 MB
spec_mii_2026-08-19-14-15-05_0238b8c1ff597a218b5b7d53d48de09b.pdf
GEM_SPEC • 0.55 MB
gtc.pdf
GEM_OTHER • 0.71 MB
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