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| # | Company | Amount | Rank | Status |
|---|---|---|---|---|
| 1 | L1₹2.1 CrAccepted-Finance | ₹2.1 Cr | L1 | Accepted-Finance Accepted as L1 bidder |
| 2 | L2₹2.3 Cr+₹26.6 L (12.7%)Accepted-Finance | ₹2.3 Cr+₹26.6 L (12.7%) | L2 | Accepted-Finance Accepted as L2 bidder |
| 3 | L3₹2.9 Cr+₹79.7 L (38.2%)Accepted-Finance | ₹2.9 Cr+₹79.7 L (38.2%) | L3 | Accepted-Finance Accepted as L3 bidder |
| 4 | L4₹3.1 Cr+₹1.0 Cr (48.4%)Accepted-Finance | ₹3.1 Cr+₹1.0 Cr (48.4%) | L4 | Accepted-Finance Accepted as L4 bidder |
| 5 | L5₹4.5 Cr+₹2.4 Cr (114.7%)Accepted-Finance | ₹4.5 Cr+₹2.4 Cr (114.7%) | L5 | Accepted-Finance Accepted as L5 bidder |
Tender Value
Refer Docs
EMD Value
₹5 L
Closing Date
25 May 2020, 6:00 pmClosed
SECTION HEAD,PURCHASE
CDAC, VELLAYAMBALAM, TRIVANDRUM
THE HIRING OF DESIGN SERVICE PARTNER FOR MULTIMILLION GATE ASIC DESIGN AND TAPE OUT IN DEEP SUB MICRON TECHNOLOGY NODES FOR COMPLEX DIGITAL SYSTEM DESIGNS (DSP-ICD)
2020_DIT_547937_1
CDACT.PHS.RD.HDG083D.471.19-20
Open Tender
Miscellaneous Services
Works
210 days
CDAC
Please refer Tender documents.
8 documents required · 8 mandatory
₹2,240
Yes
CDAC
₹5 L
Yes
CDAC,TRIVANDRUM
20 Oct 2020
26 Feb 2020
26 May 2020
26 Feb 2020
25 May 2020
19 Mar 2020
10 Mar 2020
Fee Component for executing the project and services (FF)
Cost of executing RTL to GDSII design & Tapeout
InSemi Technology Services Private Limited
Tessolve Semiconductor Pvt. Ltd.
SKANDYSYS PRIVATE LIMITED
Soctronics Technologies Private Limited
stage.html
html • 0.05 MB
tech_bid_open.pdf
tech_eval.pdf
fin_bid_open.pdf
boq_comp_chart.xlsx
xlsx
fin_eval.pdf
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details.html
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