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Public records across all portals
Test/Burn-in Socket for 192 BGA Device (17mmX 17mm), Test/Burn-in Socket for 204 BGA Device (17mmX 17mm), Test/Burn-in Socket for 484 BGA Device (23mm x 23mm)
Test/Burn- in Socket, 64 Pin DIP, ZIF (Zero Insertion Force) Pitch: 0.1” (2.54mm), Row Spacing: 22.8
Test/Burn-in Socket for 192 BGA Device (17mmX 17mm), Test/Burn-in Socket for 204 BGA Device (17mmX 17mm), Test/Burn-in Socket for 484 BGA Device (23mm x 23mm)
Test/Burn- in Socket, 64 Pin DIP, ZIF (Zero Insertion Force) Pitch: 0.1” (2.54mm), Row Spacing: 22.8
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This profile is built from what portals disclose publicly. Since several states never release bidder lists or quoted prices, it likely understates the company’s true footprint. A tender is counted as won when the company either received the award or stood L1 at financial bid opening, even if the formal award is still pending. TenderKart compiles these public records independently and has no association with any government portal, buyer, or bidder.